Manufacturing method of circuit-component built-in substrate
The present invention provides a manufacturing method of a circuit-component built-in substrate using a prepreg material utilizing epoxy resin as the main ingredient and having electrical connection reliability. The method comprises: a circuit component installation step that forms one or more than...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The present invention provides a manufacturing method of a circuit-component built-in substrate using a prepreg material utilizing epoxy resin as the main ingredient and having electrical connection reliability. The method comprises: a circuit component installation step that forms one or more than one through holes in the direction of the thickness of a first insulation substrate material, and inserting circuit components into all or a part of through holes to make both the electrode terminals above or below it are orientated toward the thickness direction; an internal through hole formation step that forms one or more than one first through holes in the direction of the thickness of a second insulation substrate material and fills a first conductive composition into the first through hole(s) to form the first internal through holes for electrical connection; and a laminate pressing/heating step that allocates the second insulation substrate material with the first internal through hole(s) to both sides of t |
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