Plasma processing system with movable chamber housing parts

A substrate processing system includes a vertically movable chamber section so that chamber sections are vertically separable to provide open and closed positions of a processing chamber or reactor, such as a plasma enhanced CVD chamber. In the open position, substrates are loaded and unloaded from...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	EHRENSPERGER, DAMIAN, CHAUDHARY, DEVENDRA, LOCHER, DANIEL, WAGNER, PHILIPP, KLINDWORTH, MARKUS, WIELAND, WERNER
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A substrate processing system includes a vertically movable chamber section so that chamber sections are vertically separable to provide open and closed positions of a processing chamber or reactor, such as a plasma enhanced CVD chamber. In the open position, substrates are loaded and unloaded from the processing chamber, while in the closed position an enclosed processing volume is provided for processing substrates, particularly for processing large substrates (e.g., one square meter or larger) with a small gap (3-10mm) between electrodes. Plural processing chambers can be provided and coupled to an actuator assembly for simultaneously vertically moving a chamber section or chamber portion of each processing chamber. Lift pins for receiving and positioning of substrates within the processing chambers can also be moved by the actuator assembly. A removable mounting arrangement is also provided for the lift pins.