Method of electronic circuit production with a conductive protective layer

The invention relates to a method of circuit production including the step consisting of connecting an electronic component to a bottom wall of a cavity with or without an intermediate wire connection, the method including a preliminary step to a step of etching which consists of depositing a layer...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LECHLEITER, FRANCOIS, DIEU-GOMONT, SEVERINE, DE MAQUILLE, YANNICK
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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