Method of electronic circuit production with a conductive protective layer

Method of electronic circuit production with a conductive protective layer

The invention relates to a method of circuit production including the step consisting of connecting an electronic component to a bottom wall of a cavity with or without an intermediate wire connection, the method including a preliminary step to a step of etching which consists of depositing a layer...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LECHLEITER, FRANCOIS, DIEU-GOMONT, SEVERINE, DE MAQUILLE, YANNICK
Format: Patent
Sprache:chi ; eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:The invention relates to a method of circuit production including the step consisting of connecting an electronic component to a bottom wall of a cavity with or without an intermediate wire connection, the method including a preliminary step to a step of etching which consists of depositing a layer of protective material (30) on a conductive layer (10) in the bottom of the cavity, which material is a liquid material capable of hardening and once hardened resistant to the etching solution.