Mobile phone back cover set with near field communication chip
A mobile phone back cover set with near field communication chip includes a pair of first housing and second housing capable of abutting to each other. The first housing is provided with a first connection terminal while the first housing is further provided with a wafer cassette, and the wafer cass...
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | A mobile phone back cover set with near field communication chip includes a pair of first housing and second housing capable of abutting to each other. The first housing is provided with a first connection terminal while the first housing is further provided with a wafer cassette, and the wafer cassette is provided with a near field communication chip. The near field communication chip is electrically connected to the first connection terminal. Thereby a user could dispose the mobile phone back cover having the near field communication chip on a mobile phone, and links the mobile phone through the first connection terminal so that application program within the mobile phone can be utilized to access the near field communication chip in order to obtain various information stored in the near field communication chip. |
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