LED structure having encapsulated package by dispensing

LED structure having encapsulated package by dispensing

The present invention discloses a LED structure having encapsulated package by dispensing. The LED structure includes a substrate, a chip unit, and an encapsulated package. There is at least one boundary layer on the substrate, so that the chip unit can be encapsulated by dispensing instead of by mo...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: CHEN, MING-HUNG, PAN, CHING-JEN
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:The present invention discloses a LED structure having encapsulated package by dispensing. The LED structure includes a substrate, a chip unit, and an encapsulated package. There is at least one boundary layer on the substrate, so that the chip unit can be encapsulated by dispensing instead of by molding.