Polyimide precursor, polyimide, polyimide film, polyimide metal laminate, and polyimide solution
The present invention discloses a polyimide precursor for producing a polyimide film having excellent adhesion to adhesives and/or metal layers and improved heat resistance, and also discloses a polyimide using this polyimide precursor, and a polyimide film using this polyimide. The polyimide precur...
Gespeichert in:
| Hauptverfasser: | , , |
|---|---|
| Format: | Patent |
| Sprache: | chi ; eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | OISHI, YOSHIYUKI HISANO, NOBUHARU KOHAMA, SHINICHIRO |
| description | The present invention discloses a polyimide precursor for producing a polyimide film having excellent adhesion to adhesives and/or metal layers and improved heat resistance, and also discloses a polyimide using this polyimide precursor, and a polyimide film using this polyimide. The polyimide precursor comprises a structural unit represented by general formula (AI) shown below: wherein A represents a tetravalent aromatic group or aliphatic group, B represents a divalent aromatic group, and R2 represents a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, or an alkylsilyl group having 3 to 9 carbon atoms, wherein group B in general formula (AI) comprises a triazine partial structure represented by formula (AB1) shown below: wherein R1 represents a hydrogen atom, an aliphatic alkyl group having 1 to 6 carbon atoms, or an aromatic group, and R3 represents a hydrogen atom, a methyl group or an ethyl group. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TW201350523A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TW201350523A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TW201350523A3</originalsourceid><addsrcrecordid>eNrjZEgIyM-pzMzNTElVKChKTS4tKs4v0lEogAkiMRXSMnNykfm5qSWJOQo5ibmZeYklQJWJeSlIssX5OaUlmfl5PAysaYk5xam8UJqbQdHNNcTZQze1ID8-tbggMTk1L7UkPiTcyMDQ2NTA1MjY0ZgYNQD-3z3M</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Polyimide precursor, polyimide, polyimide film, polyimide metal laminate, and polyimide solution</title><source>esp@cenet</source><creator>OISHI, YOSHIYUKI ; HISANO, NOBUHARU ; KOHAMA, SHINICHIRO</creator><creatorcontrib>OISHI, YOSHIYUKI ; HISANO, NOBUHARU ; KOHAMA, SHINICHIRO</creatorcontrib><description>The present invention discloses a polyimide precursor for producing a polyimide film having excellent adhesion to adhesives and/or metal layers and improved heat resistance, and also discloses a polyimide using this polyimide precursor, and a polyimide film using this polyimide. The polyimide precursor comprises a structural unit represented by general formula (AI) shown below: wherein A represents a tetravalent aromatic group or aliphatic group, B represents a divalent aromatic group, and R2 represents a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, or an alkylsilyl group having 3 to 9 carbon atoms, wherein group B in general formula (AI) comprises a triazine partial structure represented by formula (AB1) shown below: wherein R1 represents a hydrogen atom, an aliphatic alkyl group having 1 to 6 carbon atoms, or an aromatic group, and R3 represents a hydrogen atom, a methyl group or an ethyl group.</description><language>chi ; eng</language><subject>ADHESIVES ; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G ; CHEMICAL PAINT OR INK REMOVERS ; CHEMISTRY ; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS ; COMPOSITIONS BASED THEREON ; CORRECTING FLUIDS ; DYES ; FILLING PASTES ; GENERAL PROCESSES OF COMPOUNDING ; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC ; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS ; INKS ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; PASTES OR SOLIDS FOR COLOURING OR PRINTING ; PERFORMING OPERATIONS ; POLISHES ; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ; TECHNICAL SUBJECTS COVERED BY FORMER USPC ; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; TRANSPORTING ; USE OF MATERIALS THEREFOR ; WOODSTAINS ; WORKING-UP</subject><creationdate>2013</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20131216&DB=EPODOC&CC=TW&NR=201350523A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20131216&DB=EPODOC&CC=TW&NR=201350523A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>OISHI, YOSHIYUKI</creatorcontrib><creatorcontrib>HISANO, NOBUHARU</creatorcontrib><creatorcontrib>KOHAMA, SHINICHIRO</creatorcontrib><title>Polyimide precursor, polyimide, polyimide film, polyimide metal laminate, and polyimide solution</title><description>The present invention discloses a polyimide precursor for producing a polyimide film having excellent adhesion to adhesives and/or metal layers and improved heat resistance, and also discloses a polyimide using this polyimide precursor, and a polyimide film using this polyimide. The polyimide precursor comprises a structural unit represented by general formula (AI) shown below: wherein A represents a tetravalent aromatic group or aliphatic group, B represents a divalent aromatic group, and R2 represents a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, or an alkylsilyl group having 3 to 9 carbon atoms, wherein group B in general formula (AI) comprises a triazine partial structure represented by formula (AB1) shown below: wherein R1 represents a hydrogen atom, an aliphatic alkyl group having 1 to 6 carbon atoms, or an aromatic group, and R3 represents a hydrogen atom, a methyl group or an ethyl group.</description><subject>ADHESIVES</subject><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</subject><subject>CHEMICAL PAINT OR INK REMOVERS</subject><subject>CHEMISTRY</subject><subject>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>CORRECTING FLUIDS</subject><subject>DYES</subject><subject>FILLING PASTES</subject><subject>GENERAL PROCESSES OF COMPOUNDING</subject><subject>GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC</subject><subject>GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS</subject><subject>INKS</subject><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PAINTS</subject><subject>PASTES OR SOLIDS FOR COLOURING OR PRINTING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHES</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER USPC</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>TRANSPORTING</subject><subject>USE OF MATERIALS THEREFOR</subject><subject>WOODSTAINS</subject><subject>WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2013</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZEgIyM-pzMzNTElVKChKTS4tKs4v0lEogAkiMRXSMnNykfm5qSWJOQo5ibmZeYklQJWJeSlIssX5OaUlmfl5PAysaYk5xam8UJqbQdHNNcTZQze1ID8-tbggMTk1L7UkPiTcyMDQ2NTA1MjY0ZgYNQD-3z3M</recordid><startdate>20131216</startdate><enddate>20131216</enddate><creator>OISHI, YOSHIYUKI</creator><creator>HISANO, NOBUHARU</creator><creator>KOHAMA, SHINICHIRO</creator><scope>EVB</scope></search><sort><creationdate>20131216</creationdate><title>Polyimide precursor, polyimide, polyimide film, polyimide metal laminate, and polyimide solution</title><author>OISHI, YOSHIYUKI ; HISANO, NOBUHARU ; KOHAMA, SHINICHIRO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TW201350523A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2013</creationdate><topic>ADHESIVES</topic><topic>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</topic><topic>CHEMICAL PAINT OR INK REMOVERS</topic><topic>CHEMISTRY</topic><topic>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>CORRECTING FLUIDS</topic><topic>DYES</topic><topic>FILLING PASTES</topic><topic>GENERAL PROCESSES OF COMPOUNDING</topic><topic>GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC</topic><topic>GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS</topic><topic>INKS</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PAINTS</topic><topic>PASTES OR SOLIDS FOR COLOURING OR PRINTING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHES</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER USPC</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>TRANSPORTING</topic><topic>USE OF MATERIALS THEREFOR</topic><topic>WOODSTAINS</topic><topic>WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>OISHI, YOSHIYUKI</creatorcontrib><creatorcontrib>HISANO, NOBUHARU</creatorcontrib><creatorcontrib>KOHAMA, SHINICHIRO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>OISHI, YOSHIYUKI</au><au>HISANO, NOBUHARU</au><au>KOHAMA, SHINICHIRO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Polyimide precursor, polyimide, polyimide film, polyimide metal laminate, and polyimide solution</title><date>2013-12-16</date><risdate>2013</risdate><abstract>The present invention discloses a polyimide precursor for producing a polyimide film having excellent adhesion to adhesives and/or metal layers and improved heat resistance, and also discloses a polyimide using this polyimide precursor, and a polyimide film using this polyimide. The polyimide precursor comprises a structural unit represented by general formula (AI) shown below: wherein A represents a tetravalent aromatic group or aliphatic group, B represents a divalent aromatic group, and R2 represents a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, or an alkylsilyl group having 3 to 9 carbon atoms, wherein group B in general formula (AI) comprises a triazine partial structure represented by formula (AB1) shown below: wherein R1 represents a hydrogen atom, an aliphatic alkyl group having 1 to 6 carbon atoms, or an aromatic group, and R3 represents a hydrogen atom, a methyl group or an ethyl group.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | chi ; eng |
| recordid | cdi_epo_espacenet_TW201350523A |
| source | esp@cenet |
| subjects | ADHESIVES AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON CORRECTING FLUIDS DYES FILLING PASTES GENERAL PROCESSES OF COMPOUNDING GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS INKS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING PERFORMING OPERATIONS POLISHES TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF MATERIALS THEREFOR WOODSTAINS WORKING-UP |
| title | Polyimide precursor, polyimide, polyimide film, polyimide metal laminate, and polyimide solution |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-19T13%3A38%3A37IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=OISHI,%20YOSHIYUKI&rft.date=2013-12-16&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ETW201350523A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |