Polyimide precursor, polyimide, polyimide film, polyimide metal laminate, and polyimide solution

The present invention discloses a polyimide precursor for producing a polyimide film having excellent adhesion to adhesives and/or metal layers and improved heat resistance, and also discloses a polyimide using this polyimide precursor, and a polyimide film using this polyimide. The polyimide precur...

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Hauptverfasser: OISHI, YOSHIYUKI, HISANO, NOBUHARU, KOHAMA, SHINICHIRO
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:The present invention discloses a polyimide precursor for producing a polyimide film having excellent adhesion to adhesives and/or metal layers and improved heat resistance, and also discloses a polyimide using this polyimide precursor, and a polyimide film using this polyimide. The polyimide precursor comprises a structural unit represented by general formula (AI) shown below: wherein A represents a tetravalent aromatic group or aliphatic group, B represents a divalent aromatic group, and R2 represents a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, or an alkylsilyl group having 3 to 9 carbon atoms, wherein group B in general formula (AI) comprises a triazine partial structure represented by formula (AB1) shown below: wherein R1 represents a hydrogen atom, an aliphatic alkyl group having 1 to 6 carbon atoms, or an aromatic group, and R3 represents a hydrogen atom, a methyl group or an ethyl group.