Processing method of substrate, laminated body and semiconductor device

A processing method of a substrate includes: a step of fixing a substrate temporarily onto a support with a temporary fixing material, which includes a central portion having layers equal to two or more and a peripheral portion having excellent solvent resistance, interposed therebetween to obtain a laminated body that the central portion is covered by the support, the peripheral portion and the substrate, wherein the peripheral portion is contact with a peripheral part of face of the substrate side of the support and a peripheral part of face of the support side of the support substrate, and the central portion is contact with a central part inside the peripheral part of face of the substrate side of the support and a central part inside the peripheral part of face of the support side of the support substrate; steps of processing the substrate; a step of dissolving the peripheral portion by a solvent; and a step of peeling the substrate from the support by heating the rest of the temporary fixing material, i