Semiconductor package having light emitting diode

Semiconductor package having light emitting diode

Disclosed is a semiconductor package having a light emitting diode (LED), comprising a package substrate formed with a recessed groove, a LED chip disposed in the recessed groove and electrically connecting to the package substrate, and a fluorescent body deposited above the LED chip. The side wall...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KUAN, CHIH-WEN, CHEN, HSIEN-WEN, LAI, CHIEH-LUNG, LAI, JUI-FENG, LAI, MING-HO
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Disclosed is a semiconductor package having a light emitting diode (LED), comprising a package substrate formed with a recessed groove, a LED chip disposed in the recessed groove and electrically connecting to the package substrate, and a fluorescent body deposited above the LED chip. The side wall of the recessed groove is a non-linear surface for allowing the LED chip to be placed on the focus thereof to increase the reflective efficiency.