Evaporating apparatus for making patterns

The present invention relates to an evaporating apparatus for making patterns which deposits source on a substrate and is characterized by further including: a spray nozzle part provided with a spray opening for spraying source toward the side of the substrate, a shutter part selectively closing or...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	KIM, TAE-HWAN, NAMGOONG, SUNG-TAE, RYU, WOON-SEON
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	The present invention relates to an evaporating apparatus for making patterns which deposits source on a substrate and is characterized by further including: a spray nozzle part provided with a spray opening for spraying source toward the side of the substrate, a shutter part selectively closing or opening the spray opening of the spray nozzle part to selectively spray said source, and a delivery part used to deliver at least one of the substrate and the spray nozzle part. Thereby, this invention provides an evaporating apparatus for making patterns, which can easily evaporate predetermined patterns on a large area substrate.