Adhesive composition and uses thereof

The invention relates to an adhesive composition comprising a main component containing an epoxy monomer and a rubber monomer. The adhesive composition has advantages of low dielectric constant, high glass transition temperature, good resin flow and flexibility. A laminate material and an electronic...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	CHUANG, CHAOIN, HUANG, TANGIEH
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES PRINTED CIRCUITS USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The invention relates to an adhesive composition comprising a main component containing an epoxy monomer and a rubber monomer. The adhesive composition has advantages of low dielectric constant, high glass transition temperature, good resin flow and flexibility. A laminate material and an electronic component are also provided in the invention.