Press-bonding method and press-bonding device for panel terminal part

The purpose of the present invention is to provide a device for press-bonding a panel terminal part in which a constant heating format is used, wherein it is possible to prevent floating of the flexible substrate during press-bonding. The proposed device for press-bonding a panel terminal part is provided with: a press-bonding head part for performing press-bonding on the terminal part; a heater for heating the press-bonding head part at a constant temperature; a raising/lowering mechanism for raising/lowering the press-bonding head part; and a controller for controlling the raising/lowering of the press-bonding head part by the raising/lowering mechanism. The press-bonding head part is divided into: a first head part, to which the effect of heating by the heater is transmitted; and a second head part, which heats by thermal conduction from the first head part.