Conductive pattern film substrate and manufacturing method thereof

A conductive pattern film substrate and a manufacturing method thereof are disclosed. A main body having a pattern can be combined with a thin film layer without a medium layer wherein the main body and the thin film layer are anisotropic. The manufacturing method includes generating a thermal spray...

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Bibliographische Detailangaben
Hauptverfasser:	LIU, SONG-JHE, CHANG, JACKY, LIN, ERIC
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CABLES CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL CONDUCTORS DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL INSULATORS METALLURGY SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	A conductive pattern film substrate and a manufacturing method thereof are disclosed. A main body having a pattern can be combined with a thin film layer without a medium layer wherein the main body and the thin film layer are anisotropic. The manufacturing method includes generating a thermal spray source to heat the thin film layer so that the thin film layer is melt and transforms to the molecular status. The thermal spray source sprays the thin film molecules to the pattern layer on the main body. The main body has the electricity characteristics of the main body having such pattern.