Anisotropic conductive film and semiconductor device

Disclosed herein is an anisotropic conductive film including both polyester urethane resins and tricyclodecane dimethanol diacrylate, and a semiconductor device comprising the same. The anisotropic conductive film includes both polyester urethane resins and tricyclodecane dimethanol diacrylate to ha...

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Bibliographische Detailangaben
Hauptverfasser:	UH, DONG-SEON, KI, HYE-SU, KO, YOUN-JO, LEE, KIL-YONG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES PRINTED CIRCUITS USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	Disclosed herein is an anisotropic conductive film including both polyester urethane resins and tricyclodecane dimethanol diacrylate, and a semiconductor device comprising the same. The anisotropic conductive film includes both polyester urethane resins and tricyclodecane dimethanol diacrylate to have high storage modulus, thereby exhibiting great tolerance to contraction and expansion, allowing fewer bubbles, and having excellent adhesive strength reliability and connection reliability even after long-term storage under high temperature and humidity.