Packaging structure and manufacturing method for the same

A packaging structure and a manufacturing method for the same are provided. The packaging structure includes a chip, a substrate and at least one adhesive layer. The chip has at least one electrode portion. The substrate has at least one circuit portion. The at least one adhesive layer is disposed b...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LOU, WEING, CHIANG, CHUNG-I, JAN, FONG-YEE
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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