Packaging structure and manufacturing method for the same

A packaging structure and a manufacturing method for the same are provided. The packaging structure includes a chip, a substrate and at least one adhesive layer. The chip has at least one electrode portion. The substrate has at least one circuit portion. The at least one adhesive layer is disposed between the at least one electrode portion and the at least one circuit portion and forms electrical connection therebetween. The adhesive layer is a material with a Negative Coefficient of Thermal Expansion (Negative CTE) and the material comprising a metal compound material. Because of the material with a Negative CTE, the alignment shift can be avoided after adhere the chip and the substrate.