A packaging method for light emitting die and structure thereof

A packaging method for light emitting die and structure thereof

First, laser drilling a plurality of holes in a flexible substrate; then, electroplating a heat conductor in every hole; then, metal depositing a die bonding layer in the flexible substrate; then, putting the light emitting die on the die bonding layer; then, heating the die bonding layer at a first...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: YANG, HAN-PING, HUANG, MENGI, LIN, JIAN-SHIAN, KAO, TUNE-HUNE
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:First, laser drilling a plurality of holes in a flexible substrate; then, electroplating a heat conductor in every hole; then, metal depositing a die bonding layer in the flexible substrate; then, putting the light emitting die on the die bonding layer; then, heating the die bonding layer at a first temperature and combining the light emitting die with the flexible substrate; finally, heating the die bonding layer at a second temperature and fusing the die bonding layer and the heat conductors. This proposal also brings up the structure of light emitting die as above.