Light-emitting package structure

Provided is a light-emitting package structure, comprising a carrier member, a light-emitting chip disposed on the carrier member; an encapsulant enclosing the light-emitting chip and having opposing first and second surfaces formed thereon and a side surface connected to the first and second surfaces; a first reflective member embedded into while exposing from the second surface of the encapsulant; a fluorescent layer disposed on the first reflective member; and a second reflective member disposed on the side surface of the encapsulant. The light-emitting chip can expand the light through the first reflective member, reduce the degree of white light, and reflect the encapsulant through the second reflective member to eliminate the glare therefrom.