Wafer level package and manufacturing method thereof

Wafer level package and manufacturing method thereof

The manufacturing methods of the wafer level package structure include forming through-mold plugs penetrating through the molding compound by shooting metal pins into the molding compound.

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: ESSIG, KAY, APPELT, BERND KARL
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:The manufacturing methods of the wafer level package structure include forming through-mold plugs penetrating through the molding compound by shooting metal pins into the molding compound.