Component carrier compound and method for producing a plurality of component carrier regions

A component carrier compound (1) with several component carrier regions (10), which is used for fixation of semiconductor components, is given. The component carrier compound has a carrier body (2) with a first main face (21). In the carrier body, from the first main face a trench structure (3) is formed with first trenches (31) extending mutually parallel along a first direction, wherein the first trenches confine the component carrier regions in a second direction extending transverse to the trenches. On the carrier body is formed a coating (4), so that the component carrier regions have respectively a first main face, coated at least regionally, of the carrier body and a side face (5), coated at least regionally, of the trench structure. In addition, a method for producing a plurality of component carrier regions is given.