Heat dissipation module

A heat dissipation module used for an electronic device is provided. The electronic device includes a base and a heat generating element. The heat dissipation module includes a fixing structure and a heat sink. The fixing structure includes a bottom frame and a clamping member. The bottom frame asse...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHUANG, CHIH-WEI, YEH, YUNIEH
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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