Heat dissipation module

A heat dissipation module used for an electronic device is provided. The electronic device includes a base and a heat generating element. The heat dissipation module includes a fixing structure and a heat sink. The fixing structure includes a bottom frame and a clamping member. The bottom frame asse...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	CHUANG, CHIH-WEI, YEH, YUNIEH
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	A heat dissipation module used for an electronic device is provided. The electronic device includes a base and a heat generating element. The heat dissipation module includes a fixing structure and a heat sink. The fixing structure includes a bottom frame and a clamping member. The bottom frame assembled on the base has a first guiding portion and a second guiding portion. The clamping member is pivoted to the bottom frame. The heat sink is assembled to the bottom frame. The clamping member rotates relative to the bottom frame and moves along the first and the second guiding portion then position limited therein orderly, such that the heat sink is latched on the bottom frame by the clamping member and contacts against the heat generating element.