Heat dissipation module

Heat dissipation module

A heat dissipation module used for an electronic device is provided. The electronic device includes a base and a heat generating element. The heat dissipation module includes a fixing structure and a heat sink. The fixing structure includes a bottom frame and a clamping member. The bottom frame asse...

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Hauptverfasser: CHUANG, CHIH-WEI, YEH, YUNIEH
Format: Patent
Sprache:chi ; eng
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CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator CHUANG, CHIH-WEI
YEH, YUNIEH
description A heat dissipation module used for an electronic device is provided. The electronic device includes a base and a heat generating element. The heat dissipation module includes a fixing structure and a heat sink. The fixing structure includes a bottom frame and a clamping member. The bottom frame assembled on the base has a first guiding portion and a second guiding portion. The clamping member is pivoted to the bottom frame. The heat sink is assembled to the bottom frame. The clamping member rotates relative to the bottom frame and moves along the first and the second guiding portion then position limited therein orderly, such that the heat sink is latched on the bottom frame by the clamping member and contacts against the heat generating element.
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title Heat dissipation module
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