Folding methods for making frames of board level electromagnetic interference (EMI) shields

Disclosed herein are exemplary embodiments of methods of making frames for electromagnetic (EMI) shielding apparatus. An exemplary method generally includes forming a frame to have at least a first frame portion, a second frame portion, and a common sidewall including at least a portion shared by an...

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Bibliographische Detailangaben
Hauptverfasser:	KORUS, ZBIGNIEW M, VINOKUR, IGOR, ENGLISH, GERALD R
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Beschreibung
Zusammenfassung:	Disclosed herein are exemplary embodiments of methods of making frames for electromagnetic (EMI) shielding apparatus. An exemplary method generally includes forming a frame to have at least a first frame portion, a second frame portion, and a common sidewall including at least a portion shared by and connecting the first and second frame portions. The second frame portion is repositioned from being disposed within a footprint of the first frame portion to outside the footprint of the first frame portion. Another exemplary embodiment includes a frame having first and second frame portions. The second frame portion is of a size sufficient to fit within an interior region defined by the first frame portion. The first and second frame portions share at least a portion of a common sidewall having a bendable hinge portion that connects the second frame portion to the first frame portion.