Cathode unit

A cathode unit is used for a film formation apparatus, the cathode unit including a plurality of targets provided in a film formation space, each target including a backing plate, a first base material, a second base material, and a rotation shaft, the backing plate having a first main surface, a se...

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Bibliographische Detailangaben
Hauptverfasser:	SATO, SHIGEMITSU, OHNO, TETSUHIRO, OOZORA, HIROKI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	A cathode unit is used for a film formation apparatus, the cathode unit including a plurality of targets provided in a film formation space, each target including a backing plate, a first base material, a second base material, and a rotation shaft, the backing plate having a first main surface, a second main surface which is positioned on the opposite side of the first main surface, a first side face, and a second side face which is positioned on the opposite side of the first side face, the first base material being disposed on the first main surface, the second base material being disposed on the second main surface, the rotation shaft penetrating through the backing plate from the first side face to the second side face, a plurality of rotation shafts being disposed on the same plane so as to be parallel to each other; a plurality of control sections, each control section rotating the rotation shaft and applying a voltage used for sputtering to the target via the rotation shaft, the control sections being