Method of manufacturing a surface mounted device and corresponding surface mounted device

Method of manufacturing a surface mounted device and corresponding surface mounted device

The inventions relates to a method of manufacturing a flexible surface mounted device, the method comprising: bonding a main face (24) of a conductive layer (10) to an insulating layer (8); linking electrically and mechanically at least one electronic surface mounted component (40) to the conductive...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: LECHLEITER, FRANCOIS
Format: Patent
Sprache:chi ; eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The inventions relates to a method of manufacturing a flexible surface mounted device, the method comprising: bonding a main face (24) of a conductive layer (10) to an insulating layer (8); linking electrically and mechanically at least one electronic surface mounted component (40) to the conductive layer (10); wherein the insulating layer (8) is punched to produce through holes (20) through which the electronic component (40) is linked to said main face (24) of the conductive layer (10).