LED package structure

Disclosed is an LED package structure, comprising a substrate, a thermal conductive connecting point, a plurality of electrical connecting points, LED chips, solder wires, and a transparent material, wherein the substrate includes opposing first and second surfaces and the first surface has a chip-p...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	WANG, JIH-FU, WANG, YUEN-HAN, LEE, MING-HSIU, CHEN, HSIEN-WEN, LEE, WEN-HAO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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