LED package structure

Disclosed is an LED package structure, comprising a substrate, a thermal conductive connecting point, a plurality of electrical connecting points, LED chips, solder wires, and a transparent material, wherein the substrate includes opposing first and second surfaces and the first surface has a chip-placement area formed thereon, the edge of the chip-placement constituting an embedding portion, the LED chip being disposed on the thermal conductive connecting point and electrically connecting to the electrical connecting points via the solder wires, and the transparent material covering the LED chips, the electrical connecting points, the chip-placement area, the embedding portion and the solder wires, such that the bonding between the chip-placement area and the transparent material can be enhanced to improve the package reliability.