Chuck structure and device for processing semiconductor substrate using the same

Disclosed herein are a chuck structure which is intended to load a semiconductor substrate on a chuck using an improved guide ring instead of a conventional lift pin, and a device for processing a semiconductor substrate using the chuck structure. The chuck structure which has a chuck and a main bod...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: HAN, KYO-SHIK, PARK, DONG-JUN, CHOI, IN-GYU, LEE, SEONG-JAE
Format: Patent
Sprache:chi ; eng
Schlagworte:
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