Chuck structure and device for processing semiconductor substrate using the same

Disclosed herein are a chuck structure which is intended to load a semiconductor substrate on a chuck using an improved guide ring instead of a conventional lift pin, and a device for processing a semiconductor substrate using the chuck structure. The chuck structure which has a chuck and a main body supporting the chuck includes a stationary guide ring, a movable guide ring, and a drive pin. The stationary guide ring is mounted to an outer circumference of the chuck, with a movable-guide-ring mounting part formed on the stationary guide ring. The movable guide ring is placed in the movable-guide-ring mounting part, and is driven up and down. The drive pin drives the movable guide ring up and down.