Central positioning structure and method of solar silicon wafer processing

The present invention provides a central positioning structure and method of solar silicon wafer processing and its characters comprise: a first bearing limit component and a second bearing limit component separately installed at the adjacent two lateral fixture positions of X,Y axes of the working...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SU, MIIN-TSAIR, LIAO, JOUIN, TING, CHIEN-PANG
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The present invention provides a central positioning structure and method of solar silicon wafer processing and its characters comprise: a first bearing limit component and a second bearing limit component separately installed at the adjacent two lateral fixture positions of X,Y axes of the working station wherein the solar silicon wafer is planned to be placed. The two adjacent lateral sides of the solar silicon wafer can be abutted on the first and second bearing limit components. A first clipping mechanism and a second clipping mechanism are separately installed at the other adjacent sides corresponding to the X, Y axis of the bearing mechanisms on the working station to clip and abut the other two adjacent lateral sides of solar cell silicon wafer by displacement movement. Distance measurement device affixed to one of the first and the second clipping mechanisms or working station is used to detect one of the following states: the clipping operation displacement of the first and second clipping mechanisms