Resin composition for photoimprinting, patterning method and etching mask

Provided is a resin composition for photoimprinting, the cured products of which have superior etch resistance and heat resistance, and a patterning method using same. A resin composition for photoimprinting comprising a photocurable monomer (A), a photocurable monomer (B), and a photopolymerization...

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Bibliographische Detailangaben
Hauptverfasser:	SATSUKA, TAKURO, FUTAESAKU, NORIO, HAYASHIDA, YOSHIHISA, TAKEMORI, TOSHIFUMI, IKEDA, TERUYO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVES AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING APPARATUS SPECIALLY ADAPTED THEREFOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL BASIC ELECTRIC ELEMENTS CHEMICAL PAINT OR INK REMOVERS CHEMISTRY CINEMATOGRAPHY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CORRECTING FLUIDS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY FILLING PASTES GENERAL PROCESSES OF COMPOUNDING GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS HOLOGRAPHY INKS MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MANUFACTURE OR TREATMENT OF NANOSTRUCTURES MATERIALS THEREFOR MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NANOTECHNOLOGY NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING PERFORMING OPERATIONS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS POLISHES PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES SPRAYING OR ATOMISING IN GENERAL TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF MATERIALS THEREFOR WOODSTAINS WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL WORKING-UP
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Beschreibung
Zusammenfassung:	Provided is a resin composition for photoimprinting, the cured products of which have superior etch resistance and heat resistance, and a patterning method using same. A resin composition for photoimprinting comprising a photocurable monomer (A), a photocurable monomer (B), and a photopolymerization initiator (C), wherein the photocurable monomer (A) is at least one kind of carbazole compound represented by formula (1), the photocurable monomer (B) contains at least one of the compounds represented by formulas (2), (3) and (4), and the weight ratio of the photocurable monomer (A) to the photocurable monomer (B) (weight of photocurable monomer (A)/weight of photocurable monomer (B)) is 30/70 - 87/13. Formula (1): (R1 represents -CH=CH2, etc. and R2 and R3 represent hydrogen, etc.) Formula (2): (R4 and R5 represent -O-CH=CH2, etc. and R6 and R7 represent hydrogen, etc.) Formula (3): (X is -O-CH=CH2, etc. and A1 - A4 are hydrogen atoms, etc. m, n and o represent 0 or 1.) Formula (4): (R8 and R9 represent -O-CH=C