Vacuum packaging of a compact external cavity laser system with wavelength tuning by using a micro-actuator

This invention relates to the vacuum package and the wavelength tuning mechanism of a compact external cavity diode laser system. The characteristic of the device on vacuum package is to use a vacuum feedthrough silicon plate applied to the package of laser system. There are several feedthroughs (electroplated copper) on this vacuum feedthrough silicon plate for electrical conduction. The purpose of these feedthroughs is to conduct the electrical current and voltage from the outside of vacuum chamber to the laser devices inside the chamber. In addition, a reserved area on the front side of the vacuum feedthrough silicon plate is anodically bonded to the pyrex vacuum chamber. After the packaging of the laser system, the pressure inside the chamber can be pumped to the desired vacuum level. Thus, the laser system can sit in an isolated environment without any noise, air turbulence and air temperature change, result in having a long term stabilized laser frequency. The characteristic of the device on wavelength