Abrasive recovery method and abrasive recovery device

Provided are an abrasive recovery method and abrasive recovery device capable of recovering a slurry comprising a highly-concentrated abrasive while avoiding increases in pressure loss and large decreases in the recovery rate due to membrane blocking. A device (1) for recovering an abrasive from a u...

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Bibliographische Detailangaben
Hauptverfasser:	ISHII, KEIICHIRO, HIOKI, SHOJI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL POLISHING SEPARATION TRANSPORTING
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Beschreibung
Zusammenfassung:	Provided are an abrasive recovery method and abrasive recovery device capable of recovering a slurry comprising a highly-concentrated abrasive while avoiding increases in pressure loss and large decreases in the recovery rate due to membrane blocking. A device (1) for recovering an abrasive from a used polishing slurry which has been used in a CMP process has a separation membrane (41) with a cylindrical hole passage into which the used polishing slurry is introduced. The hole passage of the separation membrane (41) is no more than 0.8m in length in an effective filtration unit. The abrasive recovery device (1) concentrates the abrasive of the used polishing slurry to a concentration of 10 mass% or greater.