Low adhesion backsize for silicone adhesive articles and methods

Low adhesion backsize (LAB) compositions including a silicone macromonomer co-polymerized with a crystalline (meth)acrylate monomer to form a copolymer. The copolymer exhibits a glass transition temperature of from about -15 DEG C to about 55 DEG C, and a crystalline melt transition of from about 25...

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Bibliographische Detailangaben
Hauptverfasser:	DETERMAN, MICHAEL DUANE, TSE, KIU-YUEN, GUSTAFSON, DONALD EARL, MACKEY, SONJA SUZANNE, KUMAR, RAMESH CHAND
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON DYES MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	Low adhesion backsize (LAB) compositions including a silicone macromonomer co-polymerized with a crystalline (meth)acrylate monomer to form a copolymer. The copolymer exhibits a glass transition temperature of from about -15 DEG C to about 55 DEG C, and a crystalline melt transition of from about 25 DEG C to about 80 DEG C. Articles including the LAB composition applied to a first major surface of a substrate. In some exemplary embodiments, the article is an adhesive article. In certain exemplary embodiments, the article is a pressure-sensitive adhesive (PSA) article. In some particular embodiments, the PSA article includes a silicone adhesive applied to a second major surface of the substrate opposite the LAB composition. Methods of making and using the LAB and the articles are also disclosed.