Semiconductor devices, methods of controlling temperature thereof and semiconductor package

Semiconductor devices, methods of controlling temperature thereof and semiconductor package

An example embodiment relates to a semiconductor device including a semiconductor package in which a semiconductor chip is mounted on the package substrate. The semiconductor package may include a temperature measurement device and a temperature control circuit. The temperature measurement device ma...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KIM, JAEOON, CHOI, KYOUNG-SEI, BAE, SE-RAN, CHOI, MI-NA, HWANG, HEE-JUNG, CHO, EUN-SEOK
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An example embodiment relates to a semiconductor device including a semiconductor package in which a semiconductor chip is mounted on the package substrate. The semiconductor package may include a temperature measurement device and a temperature control circuit. The temperature measurement device may measure a temperature of the semiconductor package. The temperature control circuit may change an operation speed of the semiconductor package on the basis of the temperature of the semiconductor package measured by the temperature measurement device.