Heat dissipating module

A heat dissipating module for dissipating thermal energy from a electronic element disposed on a circuit board. The heat dissipating module comprises a heat sink, a heat conductive board, plurality of fixing elements and a resilient element. The heat conductive board includes a board body and plurality of tube portions form on the board body. The tube portions used to extend through the circuit board. Each one of tube portions defines an end opening. Fixing elements extended through tube portions respectively. Each one of fixing element includes a first end portion for fixing to the board body, a second end portion for protruding the end opening of the tube portion and a pair of interfere portions. The interfere portion protrudes out of the tube portion for leaning against to the circuit board and will shrink into the tube portion by pulling the second end portion away from the end opening. Not only structure simplifier but also easier to install and separate by cooperating the fixing element and the tube por