Processes and compositions for removing substances from substrates

Processes associated apparatus and compositions useful for removing organic substances from substrates, for example, electronic device substrates such as microelectronic wafers or flat panel displays, are provided. Processes are presented that apply a minimum volume of a composition as a coating to...

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Bibliographische Detailangaben
Hauptverfasser: QUILLEN, MICHAEL WAYNE, O'DELL, DALE EDWARD, LEE, ZACHARY PHILIP, PETERS, RICHARD DALTON, HOCHSTETLER, SPENCER ERICH, MOORE, JOHN CLEAON, ARMENTROUT, RODNEY SCOTT, MUCK, DARRYL W
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:Processes associated apparatus and compositions useful for removing organic substances from substrates, for example, electronic device substrates such as microelectronic wafers or flat panel displays, are provided. Processes are presented that apply a minimum volume of a composition as a coating to the inorganic substrate whereby sufficient heat is added and the organic substances are completely removed by rinsing. The compositions and processes may be suitable for removing and, in some instances, completely dissolving photoresists of the positive and negative varieties as well as thermoset polymers from electronic devices.