Packaging structure and method for OLED

The present invention relates to a packaging structure and method for organic light emitting devices, and more particularly, to a packaging technique developed for semiconductor industry aiming for weight and thickness reduction.

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Bibliographische Detailangaben
Hauptverfasser:	CHIANG, YI-LIN, JAN, DER-JUN, LIU, KOUN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ELECTRIC HEATING ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY
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Beschreibung
Zusammenfassung:	The present invention relates to a packaging structure and method for organic light emitting devices, and more particularly, to a packaging technique developed for semiconductor industry aiming for weight and thickness reduction.