Form for wire winding of bonding wire for semiconductor

To provide a form for wire winding of bonding wire for semiconductors such that even if the bonding wire is cut, springback does not occur easily, and the wire does not loosen greatly on the spool. A wire winding structure for the end part of the winding (grounding part when the wire is unwound) of the main winding part for a bonding wire wound onto the wire winding part of a spool core is provided such that the winding structure for a first layer forms a structure in which grounding wires closely adhere to each other on the spool core, and lines are formed so as to be wound in alignment, with the plurality of wires in those lines separated from each other and inserted to form a winding with a strongly adhering alignment.