Method for handling a wafer
The present invention relates to a method for handling a wafer. The invention further relates to an assembly, comprising a wafer and a support structure, wherein the support structure comprises at least one shape memory polymer film.
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| Hauptverfasser: | , , |
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| Format: | Patent |
| Sprache: | chi ; eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
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| Zusammenfassung: | The present invention relates to a method for handling a wafer. The invention further relates to an assembly, comprising a wafer and a support structure, wherein the support structure comprises at least one shape memory polymer film. |
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