Bonded substrates and methods for bonding substrates

Herein are disclosed apparatus and methods for impinging heated fluids onto the surfaces of substrates to heat the surfaces of the substrates so as to facilitate melt-bonding the substrates to each other to form a laminate. Also are disclosed are laminates in which a fibrous web is bonded to a subst...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	FERREIRO, JORGE ADRIAN, PARODI, OMAR ALBERTO, SERRA, GABRIELA FERNANDA, UNRUH, WILLIAM CHARLES, PANZA, VICTOR FELIX, BIEGLER, KRISTOPHER K, GORMAN, MICHAEL REED
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	Herein are disclosed apparatus and methods for impinging heated fluids onto the surfaces of substrates to heat the surfaces of the substrates so as to facilitate melt-bonding the substrates to each other to form a laminate. Also are disclosed are laminates in which a fibrous web is bonded to a substrate in a surface-bonded manner and/or is bonded in a loft-retaining manner. The substrate may comprise protrusions on the surface of the substrate opposite the surface that is bonded to the fibrous web.