Heat dissipation substrate and light emitting diode module using the same
This invention relates to a heat dissipation substrate, which comprises: a dielectric submount whose thermal conductivity is larger than 100 W/M.K; an isolation layer conformally formed on the surfaces of the dielectric submount; a non-metallic optical reflective layer formed on the isolation layer;...
Gespeichert in:
| Hauptverfasser: | , |
|---|---|
| Format: | Patent |
| Sprache: | chi ; eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| Zusammenfassung: | This invention relates to a heat dissipation substrate, which comprises: a dielectric submount whose thermal conductivity is larger than 100 W/M.K; an isolation layer conformally formed on the surfaces of the dielectric submount; a non-metallic optical reflective layer formed on the isolation layer; and one or more metal interconnects formed on the non-metallic optical reflective layer. |
|---|