Ignition resistant enclosure for electronic components
The present invention relates to an igntion resistant enclosure for an electronic component comprising a pair of shell elements thermoformed from a sheet comprising a carbonate polymer composition and having a thickness of from between 0.5 to 1.2 milimeters adapted to encase said electronic componen...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The present invention relates to an igntion resistant enclosure for an electronic component comprising a pair of shell elements thermoformed from a sheet comprising a carbonate polymer composition and having a thickness of from between 0.5 to 1.2 milimeters adapted to encase said electronic component wherein the shell encased electronic component achieves a rating of HB, V-2, V-i, V-0, 5VA, or 5VB by the Underwter's Laboratories' 94 (UL 94) end product flammability test procedure and methods to make said enclosure. |
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