Method of delivering electronic component
This invention provides a method of delivering electronic component. The invented method comprises the following steps: firstly, utilizing a tray which is formed with at least one accommodation chamber with opening or an array of multiple top-opening and independent accommodation chamber, placing a...
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| creator | BAI, JIN-QUAN |
| description | This invention provides a method of delivering electronic component. The invented method comprises the following steps: firstly, utilizing a tray which is formed with at least one accommodation chamber with opening or an array of multiple top-opening and independent accommodation chamber, placing a transported electronic component inside the accommodation chamber, filling the accommodation chamber with a liquid which will not react with the electronic component, and sealing the accommodation chamber. This design creates a liquid buffering effect between spaces once the electronic component of any shape is placed within. Therefore, the component will not be damaged by collision during transportation. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TW201118022A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TW201118022A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TW201118022A3</originalsourceid><addsrcrecordid>eNrjZND0TS3JyE9RyE9TSEnNySxLLcrMS1dIzUlNLinKz8tMVkjOzy3Iz0vNK-FhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfEh4UYGhoaGFgZGRo7GxKgBABiPKQA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Method of delivering electronic component</title><source>esp@cenet</source><creator>BAI, JIN-QUAN</creator><creatorcontrib>BAI, JIN-QUAN</creatorcontrib><description>This invention provides a method of delivering electronic component. The invented method comprises the following steps: firstly, utilizing a tray which is formed with at least one accommodation chamber with opening or an array of multiple top-opening and independent accommodation chamber, placing a transported electronic component inside the accommodation chamber, filling the accommodation chamber with a liquid which will not react with the electronic component, and sealing the accommodation chamber. This design creates a liquid buffering effect between spaces once the electronic component of any shape is placed within. Therefore, the component will not be damaged by collision during transportation.</description><language>chi ; eng</language><subject>ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR ; BASIC ELECTRIC ELEMENTS ; CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS ; CONVEYING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; HANDLING THIN OR FILAMENTARY MATERIAL ; PACKAGES ; PACKAGING ELEMENTS ; PACKING ; PERFORMING OPERATIONS ; PNEUMATIC TUBE CONVEYORS ; SEMICONDUCTOR DEVICES ; SHOP CONVEYOR SYSTEMS ; STORING ; TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING ORTIPPING ; TRANSPORTING</subject><creationdate>2011</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20110601&DB=EPODOC&CC=TW&NR=201118022A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20110601&DB=EPODOC&CC=TW&NR=201118022A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>BAI, JIN-QUAN</creatorcontrib><title>Method of delivering electronic component</title><description>This invention provides a method of delivering electronic component. The invented method comprises the following steps: firstly, utilizing a tray which is formed with at least one accommodation chamber with opening or an array of multiple top-opening and independent accommodation chamber, placing a transported electronic component inside the accommodation chamber, filling the accommodation chamber with a liquid which will not react with the electronic component, and sealing the accommodation chamber. This design creates a liquid buffering effect between spaces once the electronic component of any shape is placed within. Therefore, the component will not be damaged by collision during transportation.</description><subject>ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS</subject><subject>CONVEYING</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>HANDLING THIN OR FILAMENTARY MATERIAL</subject><subject>PACKAGES</subject><subject>PACKAGING ELEMENTS</subject><subject>PACKING</subject><subject>PERFORMING OPERATIONS</subject><subject>PNEUMATIC TUBE CONVEYORS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SHOP CONVEYOR SYSTEMS</subject><subject>STORING</subject><subject>TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING ORTIPPING</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2011</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZND0TS3JyE9RyE9TSEnNySxLLcrMS1dIzUlNLinKz8tMVkjOzy3Iz0vNK-FhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfEh4UYGhoaGFgZGRo7GxKgBABiPKQA</recordid><startdate>20110601</startdate><enddate>20110601</enddate><creator>BAI, JIN-QUAN</creator><scope>EVB</scope></search><sort><creationdate>20110601</creationdate><title>Method of delivering electronic component</title><author>BAI, JIN-QUAN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TW201118022A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2011</creationdate><topic>ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS</topic><topic>CONVEYING</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>HANDLING THIN OR FILAMENTARY MATERIAL</topic><topic>PACKAGES</topic><topic>PACKAGING ELEMENTS</topic><topic>PACKING</topic><topic>PERFORMING OPERATIONS</topic><topic>PNEUMATIC TUBE CONVEYORS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SHOP CONVEYOR SYSTEMS</topic><topic>STORING</topic><topic>TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING ORTIPPING</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>BAI, JIN-QUAN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>BAI, JIN-QUAN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method of delivering electronic component</title><date>2011-06-01</date><risdate>2011</risdate><abstract>This invention provides a method of delivering electronic component. The invented method comprises the following steps: firstly, utilizing a tray which is formed with at least one accommodation chamber with opening or an array of multiple top-opening and independent accommodation chamber, placing a transported electronic component inside the accommodation chamber, filling the accommodation chamber with a liquid which will not react with the electronic component, and sealing the accommodation chamber. This design creates a liquid buffering effect between spaces once the electronic component of any shape is placed within. Therefore, the component will not be damaged by collision during transportation.</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
| recordid | cdi_epo_espacenet_TW201118022A |
| source | esp@cenet |
| subjects | ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR BASIC ELECTRIC ELEMENTS CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS CONVEYING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HANDLING THIN OR FILAMENTARY MATERIAL PACKAGES PACKAGING ELEMENTS PACKING PERFORMING OPERATIONS PNEUMATIC TUBE CONVEYORS SEMICONDUCTOR DEVICES SHOP CONVEYOR SYSTEMS STORING TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING ORTIPPING TRANSPORTING |
| title | Method of delivering electronic component |
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