Method of delivering electronic component

This invention provides a method of delivering electronic component. The invented method comprises the following steps: firstly, utilizing a tray which is formed with at least one accommodation chamber with opening or an array of multiple top-opening and independent accommodation chamber, placing a...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	BAI, JIN-QUAN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR BASIC ELECTRIC ELEMENTS CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS CONVEYING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HANDLING THIN OR FILAMENTARY MATERIAL PACKAGES PACKAGING ELEMENTS PACKING PERFORMING OPERATIONS PNEUMATIC TUBE CONVEYORS SEMICONDUCTOR DEVICES SHOP CONVEYOR SYSTEMS STORING TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING ORTIPPING TRANSPORTING
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Beschreibung
Zusammenfassung:	This invention provides a method of delivering electronic component. The invented method comprises the following steps: firstly, utilizing a tray which is formed with at least one accommodation chamber with opening or an array of multiple top-opening and independent accommodation chamber, placing a transported electronic component inside the accommodation chamber, filling the accommodation chamber with a liquid which will not react with the electronic component, and sealing the accommodation chamber. This design creates a liquid buffering effect between spaces once the electronic component of any shape is placed within. Therefore, the component will not be damaged by collision during transportation.