Carrier tape for tab-package and manufacturing method thereof

The present invention relates to a carrier tape for TAB-package and a manufacturing method thereof, wherein a TAB tape including a wiring pattern and a metal plating layer formed on a base film comprises a transfer area including a row of sprocket holes arranged along the edges of the base film at p...

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Bibliographische Detailangaben
Hauptverfasser:	CHO, SANG-KI, SONG, NAK-HO, YOO, DAE-SUNG, HONG, TAE-KI, KOO, HAN-MO, LIM, JUN-YOUNG, JO, JAE-SUNG, KIM, JOOUL, PARK, KI-TAE, JO, DONG-GUK
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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