Carrier tape for tab-package and manufacturing method thereof

The present invention relates to a carrier tape for TAB-package and a manufacturing method thereof, wherein a TAB tape including a wiring pattern and a metal plating layer formed on a base film comprises a transfer area including a row of sprocket holes arranged along the edges of the base film at p...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	CHO, SANG-KI, SONG, NAK-HO, YOO, DAE-SUNG, HONG, TAE-KI, KOO, HAN-MO, LIM, JUN-YOUNG, JO, JAE-SUNG, KIM, JOOUL, PARK, KI-TAE, JO, DONG-GUK
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The present invention relates to a carrier tape for TAB-package and a manufacturing method thereof, wherein a TAB tape including a wiring pattern and a metal plating layer formed on a base film comprises a transfer area including a row of sprocket holes arranged along the edges of the base film at predetermined intervals, and wherein the transfer area includes an exposure area from which the base film is exposed, such that the present invention has an advantageous effect in that no Cu layer or a metal layer exists at a portion of sprocket holes from which friction is generated by a driving roller during assembly work between a driver IC and chips/drive IC and panel to dispense with generation of foreign objects such as Cu particles, thereby enhancing reliability of the product.