Substrate bonding system and method thereof

A substrate bonding system has a vacuum chamber, a vacuum pump to decrease the air pressure in the vacuum chamber, and a pickup stage. The pickup stage has a cylinder, a piston engaged with the cylinder, and a pickup interface. The pickup interface may be attached to a substrate, and the pickup stag...

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Bibliographische Detailangaben
Hauptverfasser:	HUANG, TING-HSUN, WANG, CHIEN-FA, CHEN, CHIHUN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING FREQUENCY-CHANGING NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PHYSICS TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF
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Beschreibung
Zusammenfassung:	A substrate bonding system has a vacuum chamber, a vacuum pump to decrease the air pressure in the vacuum chamber, and a pickup stage. The pickup stage has a cylinder, a piston engaged with the cylinder, and a pickup interface. The pickup interface may be attached to a substrate, and the pickup stage and the substrate may form a close space. When the pressure in the vacuum chamber is decreasing, the piston will moves to enlarge the space to make the pressure in the space smaller than the pressure in the vacuum chamber. The pickup interface is attached to the substrate by using the pressure difference between the vacuum chamber and the space.